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200μm HPCF Fiber for Data-communication

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Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible 說明:Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible

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Characteristics

 Step index
○ Low-OH,synthetic fused silica core,PolyClad hard polymer clad,ETFE buffer or jacket
○ Broad operating wavelength range, optimized at 650 and 850nm
 Minimal connector offsets due to high clad/core diameter ratio
 High tensile strength and minimal bend radius for high reliability
 Crimp/cleave and epoxy/polish compatible
 Large core and high na provides easy termination and high coupling efficiency to light source
○ Chemically resistant
Flame retardant
○ Short-to-medium distance data communications for factory automation and process control

ROHS compliant

Specifications

Applications

Chemical plants  

Refineries  

Avionics  

Automotive Production/manufacturing plants    

platforms  

Wind power  

Power plants 

PLC’S





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